MEMS pressure die is a piezoresistive pressure sensor using MEMS processing technology, which is high precision, small size and long-term reliability. It is widely used in automotive electronics, medical system, navigation system, weather monitoring, consumer electronics

  • >More
  • MEMS pressure sensor chip is packaged by Beetech self-developed opened window packaging (BOWP) technology, which is small size and high reliability

  • >More
  • Signal conditioning chip is integration with a built-in temperature sensor.It can make digital compensation for The measuring result of MEMS pressure sensor chip and help users shortening the development period, reducing costs and simplifying the post production process.

  • >More
  • After the pressure signal was amplified and temperature compensated, the MEMS pressure sensor module can output 0-1V absolute voltage signal, proportional voltage signal, and temperature or sensor bridge digital signal. It can directly match back-end client system with high precision and small temperature coefficient.

  • >More
  • News | Contact Us |
    京ICP备 09034664 | Copyright @2014 MEMS All rights reserved